This Silver Heat Transfer Kit for High-Performance CPUs is a thermal compound designed to maximize thermal conductivity between the CPU and heat sink/fan assembly.
The kit includes 5 high-performance thermal pastes that are 100% brand new and of high quality. With a thermal conductivity of >3.05W/m.
k and thermal resistance of <0.073°c-in 2/w, this kit is ideal for high-performance CPUs. T…

This silver heat paste is a thermal compound designed to improve the cooling performance of CPUs.
With a weight of 1.0g per tube, it is made of polysynthetic silver and contains 20% metal oxide compounds. It has an operation temperature range of -50/280°c and a thermal conductivity of >3.17W/m.
k, with a thermal resistance of <0.067°c-in 2/w. The product comes with a 30-day return policy a…

This thermal compound paste is designed to maximize thermal conductivity between the CPU and heat sink/fan assembly.
It is made with polysynthetic silver and contains 20% metal oxide compounds. With a weight of 1.0g/tube and an operation temperature range of -50/280°c, it offers a thermal conductivity of >3.17W/m.
k and thermal resistance of <0.067°c-in 2/w. The product comes in a 5-pack s…

This high-quality silver heat transfer paste is designed for high-performance cooling.
With a thermal conductivity of 8.5 W/m-K and a thermal impedance of less than 0.190, it guarantees efficient dissipation of heat generated from the CPU or GPU.
Composed of carbon micro-particles, it is safe to use as it does not contain any metallic particles that could cause damage to electrical pins.<…

This thermal compound is a high-performance solution for enhancing CPU cooling.
With a thermal conductivity of 8.5 W/m-K and a thermal impedance of less than 0.190, it effectively dissipates heat generated by the CPU or GPU, making it suitable for overclocking.
The compound is composed of carbon micro-particles, which ensure excellent thermal conductivity without any metallic particles th…

This soldering flux is a silver solder paste with a flux blend.
It produces a bright silver finish that won't tarnish or blacken. The paste makes soldering easier, allowing even those with less experience to achieve a quality joint.
This product is offered at a bargain price and is part of the Grey Pneumatic line of products.

The Gold Heat Paste Trio is a thermal compound paste designed to maximize the thermal conductivity between the CPU and heat sink/fan assembly.
With a thermal conductivity of over 3.05W/m.k and thermal resistance of less than 0.073°c-in 2/w, it offers high performance for your computer's cooling needs.
The package includes three tubes of the paste, each containing 1.0g. It has an operation…

This Thermal Pad is a high-quality, cost-effective solution for ensuring even heat distribution between heatsinks and IC chips.
With a continuous temperature range of -40C to 260C and a breakdown voltage of 4kv/mm, it is a reliable option for a variety of applications.
The pad is made of silicone paste gel and measures 100mm x 100mm x 0.5mm. Please note that for international orders, deli…

The Silver Heat Syringe is a high-performance thermal compound suitable for attaching heat sinks, CPU fans, GPU coolers, LED chips, or anything else that requires strong thermal conductivity.
With a huge 20g syringe, it provides enough compound for 50 large CPUs and boasts excellent thermal conductivity of >3.17W/(m-K).
The compound is odorless, non-volatile, non-corrosive, non-toxic, and…

This thermal compound paste is a high-quality product that maximizes thermal conductivity between the CPU and heat sink/fan assembly.
It is made of polysynthetic silver and contains 20% metal oxide compounds. With a thermal conductivity of over 3.05W/m.k and thermal resistance of less than 0.073°c-in 2/w, it provides excellent performance.
The paste has a weight of 1.0g/tube and can opera…