The FlowEase Soldering Aid is a high-quality soldering flux designed for rework, sphere or pin attachment to BGA, CGA and CSP packages. This no-clean flux is known for its minimum residue, good tinning, bright soldering point and less smoke. It is widely used for moderate activity of rosin flux paste, making it ideal for phone card computer graphics card SMD rework. The RMA-218 flux paste can stick more tightly, ensuring a hood quality finish. The package includes RMA-218 Flux and Needle ONLY, other accessories are not included.
RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin. graphics card SMD rework. - Most Widely used for moderate activity of rosin flux paste, the phone card computer.
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